DocumentCode :
2140704
Title :
New insight into hot-electron-induced degradation of n-MOSFETs
Author :
Chan, T.Y. ; Chiang, C.L. ; Gaw, H.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
1988
fDate :
11-14 Dec. 1988
Firstpage :
196
Lastpage :
199
Abstract :
The channel electric field is found to be as important as the substrate current in understanding hot-electron-induced (MOSFET) degradation. It is shown that only when the combined effect of the channel field and substrate current is considered can all the experimental results, covering a wide range of bias conditions, channel lengths, and oxide thickness, be fully accounted for. It is demonstrated that long-channel MOSFETs are still prone to hot-electron-induced degradation in analog circuits where a 10-V supply is used. A novel characterization methodology to ensure hot-electron reliability in various types of circuits is presented.<>
Keywords :
hot carriers; insulated gate field effect transistors; reliability; semiconductor device testing; MOSFETs; analog circuits; bias conditions; channel electric field; channel lengths; characterization methodology; hot-electron reliability; hot-electron-induced degradation; oxide thickness; substrate current; Analog circuits; Analytical models; Current measurement; Degradation; Hot carriers; Ice thickness; MOSFET circuits; Time measurement; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.1988.32789
Filename :
32789
Link To Document :
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