DocumentCode
2140895
Title
Real-time VLSI architecture for hyperspectral image classification using the constrained linear discriminant algorithm
Author
Du, Qian ; Nekovei, Reza
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Texas A&M Univ., Kingsville, TX, USA
Volume
6
fYear
2002
fDate
2002
Firstpage
3384
Abstract
A parallel/pipelined VLSI architecture designed to maximize concurrency and throughput is described for real-time hyperspectral image classification. To obtain a real-time architecture, we first simplified the constrained linear discriminant analysis (CLDA) algorithm and its computation flow. Next, we folded and modified its structure to reduce data dependency, to increase pipelining, and to minimize the silicon area. The required and yet slow data whitening process was avoided by using a modified target classifier, it is shown that applying the modified target classifier to the original data is equivalent to applying the original target classifier to the whitened data. Additionally, a high performance iterative matrix inversion algorithm simplifies the circuit complexity and improves processing time for repetitive matrix inversions and updates. Finally, to manage the high volume of data, an internal numerical representation is used. Additionally, a multiplexed bus reduces the I/O pins by sharing input data pins with pins to download registers with their initial values.
Keywords
VLSI; image classification; parallel architectures; pipeline processing; remote sensing; CLDA; circuit complexity; computation flow; constrained linear discriminant analysis algorithm; data whitening process; hyperspectral image classification; internal numerical representation; iterative matrix inversion algorithm; modified target classifier; multiplexed bus; pipelining; processing time; real-time VLSI architecture; repetitive matrix inversions; silicon area; whitened data; Computer architecture; Concurrent computing; Hyperspectral imaging; Image classification; Linear discriminant analysis; Pins; Pipeline processing; Silicon; Throughput; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Geoscience and Remote Sensing Symposium, 2002. IGARSS '02. 2002 IEEE International
Print_ISBN
0-7803-7536-X
Type
conf
DOI
10.1109/IGARSS.2002.1027190
Filename
1027190
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