Title :
Area array encapsulation with stencil printing and microwave curing
Author :
Hubbard, Robert L. ; Fathi, Zak ; Ahmad, Iftikhar ; Schake, Jeff ; Zhao, Renzhe ; Toleno, Brian
Author_Institution :
Lambda Technol., Inc., Morrisville, NC
Abstract :
An alternative to the transfer molding of area array packages is the stencil printing of the encapsulant followed by a variable frequency microwave (VFM) cure process. A block of epoxy encapsulant resin was stencil printed over a square array of ICs bonded to a printed circuit board. The board circuitry included tuned microwave structures that focused curing of the edges of the encapsulant while the bulk was cured in the VFM oven at a low temperature in just a few minutes. A void free, fully cured encapsulant was produced with the same dimensions as the stencil and with satisfactory mechanical properties
Keywords :
curing; encapsulation; integrated circuit bonding; microwave heating; polymers; printed circuit design; transfer moulding; VFM; area array encapsulation; area array packages; epoxy encapsulant resin; integrated circuit bonding; mechanical property; microwave curing; printed circuit board; stencil printing; transfer molding; variable frequency microwave; Bonding; Curing; Encapsulation; Frequency; Microwave antenna arrays; Microwave ovens; Packaging; Printing; Resins; Transfer molding;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645693
