An embedded device technology based on a molded reconfigured wafer

We report an innovative embedded device wafer level packaging technology based on a "molded reconfigured 200 mm wafer". Silicon dice are tested, grinded, and diced. For the set-up of the "reconfigured wafer" these bare silicon dice are placed faces down onto a carrier system. The core process of this technology is the encapsulation of silicon dice. We demonstrate that compression molding is a promising approach with respect to robust processing, topology, adhesion, and reliability properties. The "molded reconfigured wafer" is the base to apply thin-film interconnects similar to back-end of line processes