DocumentCode
2141602
Title
CMOS gate height scaling
Author
Ren, Zhibin ; Schonenberg, K.T. ; Ontalus, V. ; Lauer, I. ; Butt, S.A.
Author_Institution
IBM Syst. & Technol. Group, IBM Semicond. R&D Center, Hopewell Junction, NY, USA
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
41
Lastpage
42
Abstract
The work addresses benefits and performance impacts resulted from CMOS gate height reduction. The experiment shows that capacitance arising between the CMOS source/drain contact and the gate electrode decreases about linearly as the gate height scales down. The result also shows that stress liner techniques continue providing strong performance enhancement for CMOS as the gate height scales from 100 nm to 50 nm. For ring oscillators built with 45 nm node CMOS technology, the capacitance benefit associated with gate height reduction from 100 nm to 80 nm improves the circuit speed by ~3%.
Keywords
CMOS integrated circuits; capacitance; CMOS gate height scaling; capacitance; circuit speed; gate electrode; ring oscillators; size 45 nm; source-drain contact; CMOS technology; Capacitance measurement; Compressive stress; Doping; Etching; Implants; Research and development; Silicides; Silicon compounds; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734471
Filename
4734471
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