DocumentCode :
2141602
Title :
CMOS gate height scaling
Author :
Ren, Zhibin ; Schonenberg, K.T. ; Ontalus, V. ; Lauer, I. ; Butt, S.A.
Author_Institution :
IBM Syst. & Technol. Group, IBM Semicond. R&D Center, Hopewell Junction, NY, USA
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
41
Lastpage :
42
Abstract :
The work addresses benefits and performance impacts resulted from CMOS gate height reduction. The experiment shows that capacitance arising between the CMOS source/drain contact and the gate electrode decreases about linearly as the gate height scales down. The result also shows that stress liner techniques continue providing strong performance enhancement for CMOS as the gate height scales from 100 nm to 50 nm. For ring oscillators built with 45 nm node CMOS technology, the capacitance benefit associated with gate height reduction from 100 nm to 80 nm improves the circuit speed by ~3%.
Keywords :
CMOS integrated circuits; capacitance; CMOS gate height scaling; capacitance; circuit speed; gate electrode; ring oscillators; size 45 nm; source-drain contact; CMOS technology; Capacitance measurement; Compressive stress; Doping; Etching; Implants; Research and development; Silicides; Silicon compounds; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734471
Filename :
4734471
Link To Document :
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