• DocumentCode
    2141602
  • Title

    CMOS gate height scaling

  • Author

    Ren, Zhibin ; Schonenberg, K.T. ; Ontalus, V. ; Lauer, I. ; Butt, S.A.

  • Author_Institution
    IBM Syst. & Technol. Group, IBM Semicond. R&D Center, Hopewell Junction, NY, USA
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    41
  • Lastpage
    42
  • Abstract
    The work addresses benefits and performance impacts resulted from CMOS gate height reduction. The experiment shows that capacitance arising between the CMOS source/drain contact and the gate electrode decreases about linearly as the gate height scales down. The result also shows that stress liner techniques continue providing strong performance enhancement for CMOS as the gate height scales from 100 nm to 50 nm. For ring oscillators built with 45 nm node CMOS technology, the capacitance benefit associated with gate height reduction from 100 nm to 80 nm improves the circuit speed by ~3%.
  • Keywords
    CMOS integrated circuits; capacitance; CMOS gate height scaling; capacitance; circuit speed; gate electrode; ring oscillators; size 45 nm; source-drain contact; CMOS technology; Capacitance measurement; Compressive stress; Doping; Etching; Implants; Research and development; Silicides; Silicon compounds; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734471
  • Filename
    4734471