• DocumentCode
    2141624
  • Title

    REE: Exploiting idempotent property of applications for fault detection and recovery

  • Author

    Jianli Li ; Qingping Tan ; Lanfang Tan ; Tongchuan Xin

  • Author_Institution
    Sch. of Comput., Nat. Univ. of Defense Technol., Changsha, China
  • fYear
    2013
  • fDate
    23-25 July 2013
  • Firstpage
    1623
  • Lastpage
    1627
  • Abstract
    As semiconductor technologies scale down to deep sub-micron dimensions, transient faults will soon become a critical reliability concern. This paper presents the Reliability Enhancement Exploiting (REE) technique, a software-implemented fault tolerance solution which employs idempotent property of applications. An idempotent region of code is simply one that can be re-executed multiple times and still produces the same, correct result. By instrumenting extra instructions in an idempotent region to re-execute the region, REE can detect the transient faults occurring during the execution of the idempotent region. Once a fault is detected, REE can recover from the fault by executing the idempotent region again. To the best of our knowledge, this is the first to exploit idempotent property for fault detection. With similar fault coverage to a classic solution, the memory overhead and the performance overhead have been reduced by 71.8% and 31.3%, respectively.
  • Keywords
    fault diagnosis; fault tolerance; integrated circuit reliability; semiconductor technology; REE; fault coverage; fault detection; fault recovery; fault tolerance; idempotent region; memory overhead; performance overhead; reliability enhancement exploiting technique; semiconductor technology; Circuit faults; Fault tolerance; Fault tolerant systems; Hardware; Program processors; Transient analysis; Fault tolerance; Idempotent property; Transient faults;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Natural Computation (ICNC), 2013 Ninth International Conference on
  • Conference_Location
    Shenyang
  • Type

    conf

  • DOI
    10.1109/ICNC.2013.6818241
  • Filename
    6818241