Development of Millimeter-Wave Package for W-Band

The work described in this paper summarizes the design technology for millimeter-wave MMIC packages by utilizing alumina which is a conventional material used for high frequency packages, to bring forth high reliability. To develop a high performance package and to measure S-parameter accurately at W-band, RF feedthrough of package and interconnection substrate for measurement are improved. The feedthrough structure is optimized by matching the entire transmission mode between microstripline and stripline. for transmission mode oriented structure. A new concept using Radial-Stub-Pad is applied to the interconnection substrate. With these improvements, package insertion loss is about 1dB per one port feedthrough including interconnection substrates and ribbons at 90GHz to 100GHz.