• DocumentCode
    2141829
  • Title

    The state-of-the-art mobility enhancing schemes for high-performance logic CMOS technologies

  • Author

    Chung, Steve S.

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    100
  • Lastpage
    104
  • Abstract
    In this talk, an overview of the mobility enhancing techniques for high performance/low power CMOS technologies will be introduced first. Three categories of mobility enhancing schemes with global strain, local strain, and hybrid-substrate engineering, will be discussed next. Either nMOSET or pMOSFET has their respective strategies for achieving the best device performance. However, the strain technique has indeed raised reliability issues. Different reliability issues have been observed for different strain technologies. In the past several years, we have paid much more attention on the current performance of these technologies, the device reliability study has not been sufficient in the previous studies. As a consequence, this talk will also address the importance of these mobility enhancing schemes and their impact on the device reliability for advanced CMOS technologies which utilize strain schemes for current enhancement.
  • Keywords
    CMOS logic circuits; MOSFET; carrier mobility; integrated circuit reliability; low-power electronics; semiconductor device reliability; device reliability; global strain; hybrid-substrate engineering; local strain; logic CMOS technologies; low power CMOS technologies; mobility enhancing schemes; nMOSET; pMOSFET; strain technologies; CMOS logic circuits; CMOS technology; Capacitive sensors; Germanium silicon alloys; Logic devices; MOSFET circuits; Manufacturing; Power engineering and energy; Reliability engineering; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734481
  • Filename
    4734481