Title :
Joule heating effect under accelerated electromigration in flip-chip solder joints
Author :
Chiu, S.H. ; Liang, S.W. ; Chih Chen ; Yao, D.J. ; Liu, Y.C. ; Chen, Chih ; Lin, S.H.
Author_Institution :
Dept. of Material Sci. & Eng., National Chiao Tung Univ., Hsinchu
Abstract :
This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very serious during high current stressing, and a hot spot exists in the solder bump. The hot spot may play important role in the void formation and thermomigration in solder bumps during electromigration
Keywords :
electromigration; flip-chip devices; heating; solders; voids (solid); Joule heating effect; accelerated electromigration tests; flip-chip solder joints; high current stressing; solder bump; thermomigration; void formation; Acceleration; Conductivity; Current density; Electromigration; Flip chip solder joints; Heating; Materials science and technology; Temperature; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645721
