Title :
Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces
Author :
Topper, M. ; Klein, M. ; Buschick, K. ; Glaw, V. ; Orth, K. ; Ehrmann, O. ; Hutter, M. ; Oppermann, H. ; Becker, K.-F. ; Braun, T. ; Ebling, F. ; Reichl, H. ; Kim, S. ; Tathireddy, P. ; Chakravarty, S. ; Solzbacher, F.
Author_Institution :
Fraunhofer IZM, TU-Berlin, Berlin
Abstract :
Chronically implantable, wireless neural interfaces require biocompatible, long term stable, and high density integration of all functional sub-components. For this, the integration and interconnection concept of the wireless neural interface was proposed and interconnection materials and methods were investigated and characterized. The module consists of an electronics IC assembled to an electrode array. Thin film flex coils are glued onto the back side of the IC. The IC was interconnected by AuSn reflow flip chip bonding on the backside of the Utah electrode array (UEA) and off-chip electric components were SnCu0.7 soldered on the integrated IC/UEA module to guarantee a reliable connectivity
Keywords :
assembling; biomedical electronics; copper alloys; flip-chip devices; gold alloys; integrated circuit interconnections; neural chips; prosthetics; reflow soldering; tin alloys; AuSn; IC interconnection; SnCu; Utah electrode array; biocompatible hybrid flip chip microsystem; electronics integrated circuit; interconnection materials; off-chip electric components; reflow flip chip bonding; thin film flex coils; wireless neural interfaces; Assembly; Biological materials; Bonding; Coils; Electrodes; Flip chip; Gold; Metallization; Silicon; Wireless sensor networks;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645734
