High-speed simulation of PCB emission and immunity with frequency-domain IC/LSI source models

Some recent results from research conducted in the EMC group at Okayama University are reviewed. A scheme for power-bus modeling with an analytical method is introduced. A linear macro-model for ICs/LSIs, called the LECCS model, has been developed for EMI and EMS simulation. This model has a very simple structure and is sufficiently accurate. Combining the LECCS model with analytical simulation techniques for power-bus resonance simulation provides a method for high-speed EMI simulation and decoupling evaluation related to PCB and LSI design. A useful explanation of the common-mode excitation mechanism, which utilizes the imbalance factor of a transmission line, is also presented. Some of the results were investigated by implementing prototypes of a high-speed EMI simulator, HISES.