DocumentCode :
2142402
Title :
Research on SiGeC power diodes with fast and soft recovery
Author :
Liu, Jing ; Gao, Yong ; Yang, Yuan
Author_Institution :
Dept. of Electron. Eng., Xian Univ. of Technol., Xian, China
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
180
Lastpage :
183
Abstract :
A novel type of p+(SiGeC)-n--n+ diodes with ultra fast and ultra soft reverse recovery characteristics is presented. The improvement of the novel diodes is achieved by the combination of new device structure and new semiconductor material. Based on the introduction of `ideal ohmic contact¿, the softness factor increases over four times, the reverse recovery time is over 60% short and the reverse peak current is reduced about 35%, while the blocking voltage is almost unchanged for the device with the optimized n- region doping concentration. Due to the addition of smaller-sized carbon atoms to p+(SiGe) layers, the dependence of device characteristics on critical thickness is reduced largely, which increases the device stability reduces process cost for further device process steps.
Keywords :
Ge-Si alloys; ohmic contacts; power semiconductor diodes; semiconductor materials; SiGeC; blocking voltage; device stability; ideal ohmic contact; n-region doping concentration; p+-n--n+ diodes; power diodes; reverse peak current; ultra soft reverse recovery time; Atomic layer deposition; Cathodes; Costs; Germanium silicon alloys; Ohmic contacts; P-i-n diodes; Semiconductor diodes; Silicon germanium; Stability; Voltage; SiGeC; critical thickness; softness factor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734503
Filename :
4734503
Link To Document :
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