• DocumentCode
    2142456
  • Title

    Investigation of the RESURF Dielectric Inserted (REDI) LDMOS as a novel silicon-based RF power device

  • Author

    Liu, Yuchao ; Xiao, Han ; Huang, Ru

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    188
  • Lastpage
    191
  • Abstract
    In this paper, a novel power device named as RESURF Dielectric Inserted (REDI) LDMOS is put forward. It is fully compatible with standard CMOS technology, which can sharply reduce the cost. In this novel REDI LDMOS, a RESURF structure and a dielectric region are inserted at the suitable position of the drift region to reconstruct the electric field and the electric potential distributions of the channel region and the drift region, which can effectively reduce the peak electric field and increase the breakdown voltage. The impacts of key device parameters on REDI LDMOS behaviors are comprehensively studied with device simulation tools. The structural parameters are optimized to obtain acceptable high breakdown voltage (>10 V), excellent on-state behavior and high frequency performance (>10 GHz).
  • Keywords
    MOS integrated circuits; circuit simulation; electric breakdown; radiofrequency integrated circuits; REDI LDMOS behaviors; RESURF dielectric inserted LDMOS; RESURF structure; channel region; device simulation tools; dielectric region; drift region; electric field reconstruction; electric potential distribution; high breakdown voltage; high frequency performance; on-state behavior; peak electric field; silicon-based RF power device; standard CMOS technology; CMOS technology; Costs; Dielectric devices; Electric potential; Integrated circuit technology; Radio frequency; Semiconductor device modeling; Semiconductor process modeling; Structural engineering; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734505
  • Filename
    4734505