Title :
Modeling of ESD and EMI problems in split multi-layer power distribution network
Author :
Shim, Hwang-Yoon ; Kim, JiSeong ; Yook, Jong-Gwan
Author_Institution :
Comput. Syst. Div., Samsung Electron., South Korea
Abstract :
ESD and EMI problems and their possible solutions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split I/O port ground with stitching element such as conductor or inductor is proposed, while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiation from the split power plane. Simulations based on 3D-finite difference time domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.
Keywords :
circuit simulation; distribution networks; electromagnetic interference; electrostatic discharge; finite difference time-domain analysis; integrated circuit modelling; 3D finite difference time domain; EMI modeling; ESD damage; ESD modeling; FDTD method; decoupling capacitor; electromagnetic interference; electromagnetic radiation; electrostatic discharge; high speed digital systems; multilayered PC mainboard; split I/O port ground; split multilayer power distribution network; split power plane; stitching capacitor; stitching element; Capacitors; Conductors; Digital systems; Electromagnetic interference; Electromagnetic radiation; Electrostatic discharge; Inductors; Power system modeling; Power systems; Time domain analysis;
Conference_Titel :
Electromagnetic Compatibility, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7835-0
DOI :
10.1109/ISEMC.2003.1236562
