DocumentCode :
2142711
Title :
High frequency magnetic near field measurement on LSI chip using planar multi-layer shielded loop coil
Author :
Masuda, Norio ; Tamaki, Naoya ; Kuriyama, Toshihide ; Bu, Jin Ching ; Yamaguchi, Masahiro ; Arai, Ken-lchi
Author_Institution :
Jisso Res. Labs., NEC Corp., Kawasaki, Japan
Volume :
1
fYear :
2003
fDate :
18-22 Aug. 2003
Firstpage :
80
Abstract :
Magnetic near-field measurements of circuitry are gathering increasing interest as an effective technique for detecting noise emission current sources. Against this background, we developed planar thick-film multi-layer shielded loop coils with loop apertures of 20 μm x 1000 μm and 600 μm x 600 μm. The shielded-loop structure´s main feature is the cancellation of voltage induced by the electric field. A 60-μm wide microstrip line was used as the device under test (DUT). In a spatial resolution test conducted at 1GHz, we obtained optimum spatial resolution of 90 μm at the 6 dB degrading point for a rectangular coil with a 20μm x 1000 μm aperture. This resolution level is 2.8 times better than that we obtained with our previous product comprising a low temperature co-fired ceramic (LTCC) board, because with the new coils we were able to successfully reduce the mean distance between the loop and the DUT. In measuring nonuniform magnetic field distribution near the 1.58 mm-wide microstrip line and the internal chip of a large-scale integrated (LSI) circuit, we found the new model could measure a finer distribution than our previous probe.
Keywords :
integrated circuit design; large scale integration; magnetic field measurement; thick film circuits; 1 GHz; 1.58 mm; 1000 micron; 20 micron; 60 micron; 600 micron; 90 micron; DUT; LSI chip; LTCC board; device under test; electric field; electromagnetic interference; loop apertures; low temperature co-fired ceramic; magnetic near field measurement; microstrip line; noise emission current source; nonuniform magnetic field distribution; planar multilayer shielded loop coil; shieled loop probe; spatial resolution test; thick-film process; voltage cancellation; Apertures; Coils; Frequency measurement; Large scale integration; Magnetic circuits; Magnetic field measurement; Magnetic shielding; Microstrip; Semiconductor device measurement; Spatial resolution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7835-0
Type :
conf
DOI :
10.1109/ISEMC.2003.1236568
Filename :
1236568
Link To Document :
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