Title :
An Electromagnetically Coupled Package Feed-Through Structure for Multilayer Carrier Substrates
Author :
Kassner, J. ; Menzel, W.
Author_Institution :
University of Ulm, Microwave Techniques, D-89069 Ulm, Germany. E-mail: kassner@mwt.e-technik.uni-ulm.de
Abstract :
Theoretical and first scaled experimental results are presented for an electromagnetically coupled feed-through structure for multilayer carrier substrates. This structure combines an inherent DC isolation with an improved hermetic sealing, as no conductor - at least for the RF - needs to penetrate the top layer of the substrate. The design of this interconnect is done using a FDTD software.
Keywords :
Dielectric substrates; Electromagnetic coupling; Finite difference methods; Frequency; Metallization; Microstrip; Nonhomogeneous media; Packaging; Resonance; Time domain analysis;
Conference_Titel :
Microwave Conference, 1998. 28th European
Conference_Location :
Amsterdam, Netherlands
DOI :
10.1109/EUMA.1998.338191
