Title :
Multilayer Multichip Modules for Microwave and Millimeterwave Integration
Author :
Mangold, T. ; Wolf, J. ; Töpper, M. ; Reichl, H. ; Russer, P.
Author_Institution :
Lehrstuhl fÿr Hochfrequenztechnik, Technische Universitÿt Mÿnchen, Arcisstr.21, 80333 Mÿnchen, Germany. Tel. +49(0)89-289-23371 Fax:+49(0)89-289-23365, e-mail: manaoldhft.ei.tum.de
Abstract :
We present a planar integration technology of bare dices embedded in substrates (ceramic,silicon). A thin film multilayer with dielectric polymer layers and sputtered / electroplated wiring is realized in a planar fashion on top of the embedded system. The metalization is based on a Ti:W / Cu tie layer, which is subsequently electroplated with Cu. Polyimid Pyralin¿ (2722 (Du Pont) and Cyclotene¿ (4026-46 (Dow Chemical) are used as interlevel dielectric. The paper addresses high frequency performance, electromagnetic full-wave modeling and equivalent circuit model extraction of the described technologry.
Keywords :
Dielectric films; Dielectric substrates; Dielectric thin films; Electromagnetic modeling; Embedded system; Multichip modules; Nonhomogeneous media; Polymer films; Sputtering; Wiring;
Conference_Titel :
Microwave Conference, 1998. 28th European
Conference_Location :
Amsterdam, Netherlands
DOI :
10.1109/EUMA.1998.338194
