• DocumentCode
    2143243
  • Title

    Multilayer Multichip Modules for Microwave and Millimeterwave Integration

  • Author

    Mangold, T. ; Wolf, J. ; Töpper, M. ; Reichl, H. ; Russer, P.

  • Author_Institution
    Lehrstuhl fÿr Hochfrequenztechnik, Technische Universitÿt Mÿnchen, Arcisstr.21, 80333 Mÿnchen, Germany. Tel. +49(0)89-289-23371 Fax:+49(0)89-289-23365, e-mail: manaoldhft.ei.tum.de
  • Volume
    2
  • fYear
    1998
  • fDate
    Oct. 1998
  • Firstpage
    443
  • Lastpage
    448
  • Abstract
    We present a planar integration technology of bare dices embedded in substrates (ceramic,silicon). A thin film multilayer with dielectric polymer layers and sputtered / electroplated wiring is realized in a planar fashion on top of the embedded system. The metalization is based on a Ti:W / Cu tie layer, which is subsequently electroplated with Cu. Polyimid Pyralin¿ (2722 (Du Pont) and Cyclotene¿ (4026-46 (Dow Chemical) are used as interlevel dielectric. The paper addresses high frequency performance, electromagnetic full-wave modeling and equivalent circuit model extraction of the described technologry.
  • Keywords
    Dielectric films; Dielectric substrates; Dielectric thin films; Electromagnetic modeling; Embedded system; Multichip modules; Nonhomogeneous media; Polymer films; Sputtering; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1998. 28th European
  • Conference_Location
    Amsterdam, Netherlands
  • Type

    conf

  • DOI
    10.1109/EUMA.1998.338194
  • Filename
    4139249
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2143243