DocumentCode
2143545
Title
An Indepth Evaluation of High Frequency Circuit Laminates for the Wireless Telecommunication Market
Author
Aguayo, Arturo J.
Author_Institution
Technical Support Manager, Rogers Corporation, 100 S. Roosevelt Ave, Chandler, AZ 85226 USA. Tel: 602 961-8271 Fax: 602 961-4533, art.aguayo@rogers-corp.com
Volume
2
fYear
1998
fDate
Oct. 1998
Firstpage
520
Lastpage
523
Abstract
Growth in the wireless telecommunication market. An important part to the systems is the laminate material chosen to carry the high frequency carrier signals. Available to desipers today is a wide range of materials ranging from the low cost difunctional epoxy/glass (FR4) to the high performance PTFE based laminates. This work focuses on critical electrical properties of the various laminate options and their stability against frequency and temperature. The effect of changing electrical properties is also quantified by measuring the impact on RF/microwave circuitry.
Keywords
Circuit stability; Circuit testing; Costs; Fabrication; Glass; Laminates; Radar antennas; Radio frequency; Stripline; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1998. 28th European
Conference_Location
Amsterdam, Netherlands
Type
conf
DOI
10.1109/EUMA.1998.338206
Filename
4139261
Link To Document