DocumentCode :
2143574
Title :
Overcoming post-silicon validation challenges through Quick Error Detection (QED)
Author :
Lin, David ; Hong, Ted ; Li, Yanjing ; Fallah, Farzan ; Gardner, Donald S. ; Hakim, Nagib ; Mitra, Subhasish
Author_Institution :
Department of EE, Stanford University, CA, USA
fYear :
2013
fDate :
18-22 March 2013
Firstpage :
320
Lastpage :
325
Abstract :
Existing post-silicon validation techniques are generally ad hoc, and their cost and complexity are rising faster than design cost. Hence, systematic approaches to post-silicon validation are essential. Our research indicates that many of the bottlenecks of existing post-silicon validation approaches are direct consequences of very long error detection latencies. Error detection latency is the time elapsed between the activation of a bug during post-silicon validation and its detection or manifestation as a system failure. In our earlier papers, we created the Quick Error Detection (QED) technique to overcome this significant challenge. QED systematically creates a wide variety of post-silicon validation tests to detect bugs in processor cores and uncore components of multi-core System-on-Chips (SoCs) very quickly, i.e., with very short error detection latencies. In this paper, we present an overview of QED and summarize key results: 1. Error detection latencies of “typical” post-silicon validation tests can range up to billions of clock cycles. 2. QED shortens error detection latencies by up to 6 orders of magnitude. 3. QED enables 2- to 4-fold improvement in bug coverage. QED does not require any hardware modification. Hence, it is readily applicable to existing designs.
Keywords :
Benchmark testing; Clocks; Computer bugs; Hardware; Multicore processing; Silicon; System-on-chip; Debug; Post-Silicon Validation; Quick Error Detection; Testing; Verification;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013
Conference_Location :
Grenoble, France
ISSN :
1530-1591
Print_ISBN :
978-1-4673-5071-6
Type :
conf
DOI :
10.7873/DATE.2013.077
Filename :
6513523
Link To Document :
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