• DocumentCode
    2143866
  • Title

    The driftless and electron-windless electromigration theory

  • Author

    Sah, Chih-Tang ; Jie, Bin B.

  • Author_Institution
    Peking Univ., Beijing, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    412
  • Lastpage
    415
  • Abstract
    The recently presented new theory of electromigration of metal atoms is summarized. The new theory attributes the migration to diffusion of electrical neutral atoms and generation-recombination-trapping of the electrically neutral atoms in the bulk of the metal line and on the interior surfaces of the voids in the metal line. It assumes no drift current or zero host ion current, and it asserts no electron-wind force which was assumed empirically in the 40-year-old 1969 Black model. The new theory gives the time-dependence and materials-dependences of the metal line resistance, not available previously, both of which can experimentally tested to delineate the fundamental mechanisms and pathways, and statistical void geometries. It also gives materials-dependent simple analytical formulas of time-to-failure and time-to-open-circuit for compact modeling interconnects in computer-aided design of integrated circuits.
  • Keywords
    electromigration; electron traps; electron-hole recombination; failure analysis; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; computer-aided design; diffusion; electrical neutral atoms; electromigration; generation-recombination-trapping; integrated circuit interconnections; metal atoms; metal line resistance; time-to-failure formula; time-to-open-circuit formula; Character generation; Circuit testing; Conducting materials; Electric resistance; Electromigration; Electrons; Integrated circuit interconnections; Integrated circuit modeling; Surface resistance; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734559
  • Filename
    4734559