Title :
Thermal analysis of ICs based on equivalent thermal resistance
Author :
Su, Rong ; Feng, Shiwei ; Guo, Chunsheng ; Zhang, Bin ; Meng, Hao ; Zhang, Guangchen
Author_Institution :
Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
Abstract :
The paper presents a new method to analyze the steady-state temperature distribution of integrated circuit. According to the application of ANSYS, aiming at the complicated model and large calculation amount of very large scale integrated circuits, we present a new concept defined as equivalent thermal resistance. Based on the equivalent thermal resistance, the temperature distribution of an analog integrated circuit is calculated. And the result is verified by doing a complete ANSYS analysis.
Keywords :
CMOS analogue integrated circuits; temperature distribution; thermal analysis; thermal resistance; ANSYS; analog integrated circuit; equivalent thermal resistance; steady-state temperature distribution; thermal analysis; Analog integrated circuits; Circuit simulation; Electronic packaging thermal management; Integrated circuit modeling; Semiconductor device modeling; Steady-state; Temperature distribution; Thermal conductivity; Thermal resistance; Very large scale integration; Equivalent thermal resistance; analog integrated circuit; temperature distribution;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4734562
