DocumentCode
2143981
Title
Simulation and analysis of silicon guided-wave electro-optic modulators
Author
Huang, Howard C. ; Lo, T.C.
Author_Institution
Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clear Water Bay, Hong Kong
Volume
3
fYear
1993
fDate
19-21 Oct. 1993
Firstpage
457
Abstract
Presents both electrical and optical simulations of Si guided-wave electro-optic modulators. The simulation starts with design of modulators using a 2D semiconductor process simulator. The electrical properties of the modulators are analyzed by a 2D device simulator. Thereafter, the simulated electrical parameters are converted into optical parameters by proper electro-optic coefficients. The optical simulations are performed with both finite-difference-time-domain (FDTD) and mode-propagation-by-Fourier-expansion (MPFE) methods. The advantages of combining and using these two algorithms together are better accuracy and capability of analyzing arbitrarily shaped and optically large structures. The technique is illustrated by simulation and analysis of a series of Si guided-wave electro-optic modulators.<>
Keywords
digital simulation; electro-optical devices; elemental semiconductors; finite difference time-domain analysis; integrated optics; optical modulation; optical waveguides; semiconductor device models; semiconductor device testing; series (mathematics); silicon; 2D device simulator; 2D semiconductor process simulator; FDTD; MPFE; Si; Si guided-wave electro-optic modulators; electrical simulations; finite-difference-time-domain analysis; mode-propagation-by-Fourier-expansion; optical simulation; Analytical models; Electrooptic devices; Electrooptic modulators; Optical modulation; Optical refraction; Optical variables control; Oxidation; Refractive index; Silicon; Spontaneous emission;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON '93. Proceedings. Computer, Communication, Control and Power Engineering.1993 IEEE Region 10 Conference on
Conference_Location
Beijing, China
Print_ISBN
0-7803-1233-3
Type
conf
DOI
10.1109/TENCON.1993.328022
Filename
328022
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