• DocumentCode
    2143981
  • Title

    Simulation and analysis of silicon guided-wave electro-optic modulators

  • Author

    Huang, Howard C. ; Lo, T.C.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clear Water Bay, Hong Kong
  • Volume
    3
  • fYear
    1993
  • fDate
    19-21 Oct. 1993
  • Firstpage
    457
  • Abstract
    Presents both electrical and optical simulations of Si guided-wave electro-optic modulators. The simulation starts with design of modulators using a 2D semiconductor process simulator. The electrical properties of the modulators are analyzed by a 2D device simulator. Thereafter, the simulated electrical parameters are converted into optical parameters by proper electro-optic coefficients. The optical simulations are performed with both finite-difference-time-domain (FDTD) and mode-propagation-by-Fourier-expansion (MPFE) methods. The advantages of combining and using these two algorithms together are better accuracy and capability of analyzing arbitrarily shaped and optically large structures. The technique is illustrated by simulation and analysis of a series of Si guided-wave electro-optic modulators.<>
  • Keywords
    digital simulation; electro-optical devices; elemental semiconductors; finite difference time-domain analysis; integrated optics; optical modulation; optical waveguides; semiconductor device models; semiconductor device testing; series (mathematics); silicon; 2D device simulator; 2D semiconductor process simulator; FDTD; MPFE; Si; Si guided-wave electro-optic modulators; electrical simulations; finite-difference-time-domain analysis; mode-propagation-by-Fourier-expansion; optical simulation; Analytical models; Electrooptic devices; Electrooptic modulators; Optical modulation; Optical refraction; Optical variables control; Oxidation; Refractive index; Silicon; Spontaneous emission;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON '93. Proceedings. Computer, Communication, Control and Power Engineering.1993 IEEE Region 10 Conference on
  • Conference_Location
    Beijing, China
  • Print_ISBN
    0-7803-1233-3
  • Type

    conf

  • DOI
    10.1109/TENCON.1993.328022
  • Filename
    328022