Abstract :
Co, Ni, Pt, Al, P, Cu, Zn, Ge, Ag, In, Sb or Au including in Sn-Ag based lead free solders were evaluated to study if these nanoparticles can reduce the growth of intermetallic compounds after 4 time reflow processes and thermal aging. Also, these nanoparticles were studied if they can reduce the frequency of occurrence of intermetallic compound fractures in high impact pull tests. In addition to intermetallic compound analyses, these nanoparticle effects on solder ball hardness were studied if nanoparticles affects solder hardness and displacement in drop tests. Finally, these nanoparticle effects on drop test performance were studied. This study found that Co, Ni and Pt were very effective for the growth of intermetallic compounds and drop test performance compared to Cu, Ag, Au, Zn, Al, In, P, Ge and Sb
Keywords :
ageing; materials testing; nanostructured materials; reflow soldering; silver alloys; solders; tin alloys; SnAg; drop test; intermetallic compound fractures; intermetallic compounds growth; lead free solders; nanoparticles; pull tests; reflow processes; solder ball hardness; thermal aging; Aging; Cellular phones; Electronic equipment testing; Environmentally friendly manufacturing techniques; Frequency; Gold; Intermetallic; Lead; System testing; Zinc;
