Development of 30 micron pitch bump interconnections for COC-FCBGA

Author

Iwasaki, Toshihiro ; Watanabe, Masaki ; Baba, Shinji ; Hatanaka, Yasumichi ; Idaka, Shiori ; Yokoyama, Yoshinori ; Kimura, Michitaka

Author_Institution

Jisso Technol. Dev. Dept., Renesas Technol. Corp., Hyogo

fYear

0

fDate

0-0 0

Abstract

We developed the flip-chip bonding technology on chip-on-chip (COC) package with ultra-fine pitch bump, which leads advanced high performance devices. On this package, the realization of the metallographic behavior in the micro-bump interconnection is the substantial issue for achieving good bondability and reliability. In this paper, to implement flip-chip BGA package with COC structure (COC-FCBGA), the metal systems of micro-bump and the dimension especially metal plating thickness have been optimized by precise analysis. And it is confirmed that the specification we fixed on this package would meet sufficient quality level for fine pitch bonding. This COC-FCBGA technology will meet demands for high-end system solutions in very near future

Keywords

ball grid arrays; fine-pitch technology; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; 30 micron; chip-on-chip package; fine pitch bonding; flip-chip ball grid array; flip-chip bonding; metallographic behavior; microbump interconnection; Bonding; Data communication; Electronics packaging; Large scale integration; Lead; Materials reliability; Organic materials; Research and development; Resins; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645807

Filename

1645807