DocumentCode
2144242
Title
Suppression of electron emission from large surface area stainless steel electrodes
Author
Johnson, David J. ; Fowler, William E. ; Savage, Mark E. ; Stygar, William A.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2002
fDate
2002
Firstpage
131
Lastpage
134
Abstract
Surface treatment processes for 304L and 316L stainless steel have been tested for the electron emission suppression over large area planar surfaces. Testing was performed on 17-cm-diameter electrodes with 3 to 4 mm gaps. The treatment processes for the electrodes were solvent cleaned 16 micro-inch rms surface machining, chemical polishing, hydrogen vacuum furnace firing, and gold coating. Tests were made with a 60 to 160 kV, 200 ns flat topped voltage pulse and 150 to 260 kV, 160-ns-FWHM, waveform with 1-cos(ωt) shape. Gap closure and cathode plasma area expansion rates are determined from a Child-Langmuir model. It was noted that the initial 1-μm-roughness 304L SS gave similar or perhaps slightly better results than the other preparations. Results from each of the treatment processes are discussed.
Keywords
chemical mechanical polishing; coating techniques; electrodes; electron field emission; heat treatment; machining; stainless steel; surface cleaning; surface topography; vacuum breakdown; vacuum insulation; 1-cos(ωt) shape voltage waveform; 150 to 260 kV; 3 to 4 mm; 304L stainless steel; 316L stainless steel; 60 to 160 kV; Au; Au coating; Child-Langmuir model; H2; H2 vacuum furnace firing; cathode plasma area expansion rate; chemical polishing; electron emission suppression; flat topped voltage pulse; gap closure; large area planar surfaces; solvent-cleaned surface; stainless steel electrodes; surface machining; surface roughness; surface treatment processes; Chemical processes; Electrodes; Electron emission; Hydrogen; Machining; Performance evaluation; Solvents; Steel; Surface treatment; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum, 2002. 20th International Symposium on
Print_ISBN
0-7803-7394-4
Type
conf
DOI
10.1109/ISDEIV.2002.1027326
Filename
1027326
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