• DocumentCode
    2144305
  • Title

    Investigation of the sparse MoM reaction matrices produced in stripline packaging problems

  • Author

    Wang, Xing ; Zhu, Zhaohui ; Cao, Yi ; Dvorak, Steven L. ; Prince, John L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ
  • fYear
    0
  • fDate
    0-0 0
  • Abstract
    In most applications the method of moments (MoM) generates full reaction matrices. However, in this paper, we demonstrate that sparse reaction matrices are produced when modeling stripline interconnects. This is demonstrated by investigating the sparse nature of the MoM reaction matrices that are produced when using the full-wave layered interconnect simulator (UA-FWLIS) with a parallel-plate Green´s function. In order to explain the sparse nature of the reaction matrices, the electric fields that are excited by horizontal and vertical electric dipole sources are briefly overviewed. Then the variations of the reaction elements with distance are studied, and this information is used to provide a cut-off criterion for the reaction element calculations. We found that by applying sparse matrix storage techniques and a sparse matrix solver, the matrix solution time is dramatically improved when compared with a commercial MoM-based simulator
  • Keywords
    Green´s function methods; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; method of moments; Green function; electric fields; full-wave layered interconnect simulator; horizontal electric dipole sources; method of moments reaction matrices; method of moments-based simulator; modeling stripline interconnects; sparse matrix solver; sparse matrix storage techniques; sparse reaction matrices; stripline packaging problems; vertical electric dipole sources; Application software; Computational modeling; Integrated circuit interconnections; Message-oriented middleware; Microstrip; Moment methods; Packaging; Sparse matrices; Stripline; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2006. Proceedings. 56th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0152-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2006.1645814
  • Filename
    1645814