DocumentCode :
2144364
Title :
Piezomobility description of strain-induced mobility
Author :
Neill, A. G O ; Tsang, Y.L. ; Gallacher, B.J. ; Olsen, S.H.
Author_Institution :
Sch. of Electr., Electron. & Comput. Eng., Newcastle Univ., Newcastle upon Tyne, UK
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
464
Lastpage :
467
Abstract :
The piezoresistance model has commonly been used to describe mobility enhancement for low levels of process induced stress in CMOS technology. However, many reports show it failing at the high levels of strain needed for future technology generations. This is because an approximation is made which is only valid for very low stress levels. The piezomobility formulation removes this approximation in the commonly-used piezoresistance model such that it can estimate mobility accurately to much higher stress regimes while retaining its simplicity. The validity of the new formulation is demonstrated for Monte Carlo simulations of mobility, nMOSFETs, pMOSFETs, and nanowires in stress regimes where the commonly-used piezoresistance model has previously been reported to fail.
Keywords :
CMOS integrated circuits; MOSFET; Monte Carlo methods; nanowires; piezoresistance; CMOS technology; Monte Carlo simulations; approximation; nMOSFETs; nanowires; pMOSFETs; piezomobility description; piezoresistance; process induced stress; strain-induced mobility; CMOS technology; Capacitive sensors; Electron mobility; Germanium silicon alloys; MOSFET circuits; Piezoresistance; Semiconductor device modeling; Silicon germanium; Stress; Tensile strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734581
Filename :
4734581
Link To Document :
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