• DocumentCode
    2144485
  • Title

    High performance MOSFET scaling study from bulk 45 nm technology generation

  • Author

    Wang, Xingsheng ; Roy, Scott ; Asenov, Asen

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Univ. of Glasgow, Glasgow, UK
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    484
  • Lastpage
    487
  • Abstract
    This paper presents a MOSFET scaling study based on the current 45 nm technology generation. The study is based on a real 35 nm gate length design, to which the simulation tools are carefully calibrates. Features such as strain enhancement, and high-¿ / metal gates are included in the simulations, which then exhibit equivalent performance to state-of-the-art bulk devices. Realistic choices of device dimensions and doping profiles are made for the scaled devices, which indeed demonstrate the benefits from scaling and the introduction of technology boosters.
  • Keywords
    MOSFET; nanoelectronics; semiconductor doping; semiconductor process modelling; technology CAD (electronics); TCAD process simulation; doping profile; high performance MOSFET scaling study; high-¿ metal gates; size 45 nm; state-of-the-art bulk devices; strain enhancement; technology booster; Capacitive sensors; Doping profiles; Electric variables; Etching; High K dielectric materials; High-K gate dielectrics; MOSFET circuits; Modems; Semiconductor process modeling; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734586
  • Filename
    4734586