DocumentCode :
2144485
Title :
High performance MOSFET scaling study from bulk 45 nm technology generation
Author :
Wang, Xingsheng ; Roy, Scott ; Asenov, Asen
Author_Institution :
Dept. of Electron. & Electr. Eng., Univ. of Glasgow, Glasgow, UK
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
484
Lastpage :
487
Abstract :
This paper presents a MOSFET scaling study based on the current 45 nm technology generation. The study is based on a real 35 nm gate length design, to which the simulation tools are carefully calibrates. Features such as strain enhancement, and high-¿ / metal gates are included in the simulations, which then exhibit equivalent performance to state-of-the-art bulk devices. Realistic choices of device dimensions and doping profiles are made for the scaled devices, which indeed demonstrate the benefits from scaling and the introduction of technology boosters.
Keywords :
MOSFET; nanoelectronics; semiconductor doping; semiconductor process modelling; technology CAD (electronics); TCAD process simulation; doping profile; high performance MOSFET scaling study; high-¿ metal gates; size 45 nm; state-of-the-art bulk devices; strain enhancement; technology booster; Capacitive sensors; Doping profiles; Electric variables; Etching; High K dielectric materials; High-K gate dielectrics; MOSFET circuits; Modems; Semiconductor process modeling; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734586
Filename :
4734586
Link To Document :
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