Title :
Fabrication and DC current-voltage characteristics of real space transfer transistor with dual-quantum-well channel
Author :
Yu, Xin ; Zhang, Shilin ; Mao, Luhong ; Guo, Weilian ; Wang, Xiaoli
Author_Institution :
Sch. of Electron. Inf. Eng., Tianjin Univ., Tianjin, China
Abstract :
We reported the standard ¿¿¿ shape negative differential resistance as well as a level and smooth valley region in real space transfer transistor (RSTT) with dual-quantum-well channel, which are formed by ¿-doping GaAs quantum-well and InGaAs/GaAs heterojunction quantum-well. The highest peak-to-valley current ratio (PVCR) of RSTT reaches 4 at room temperature. The highest peak current density transconductance (¿JP/¿VGS) is 130 ms/mm, which demonstrates the control ability of gate to JP. The mechanism of obvious NDR of RSTT can be explained that the hot electron in the InGaAs U-shaped quantum-well channel transfers into V-shaped ¿-doping GaAs quantum-well channel, and the hot electron transfers into gate electrode from V-shaped ¿-doping GaAs quantum-well channel. This novel NDR device would be expected to applied in NDR circuits to instead of RTD+HEMT.
Keywords :
III-V semiconductors; current density; gallium arsenide; high electron mobility transistors; hot carriers; indium compounds; semiconductor heterojunctions; semiconductor quantum wells; DC current-voltage characteristics; InGaAs-GaAs; PHEMT; current density; dual-quantum-well channel; heterojunction quantum well; hot electron; negative differential resistance; peak-valley current ratio; real space transfer transistor; temperature 293 K to 298 K; transconductance; Current-voltage characteristics; Electrons; Fabrication; Gallium arsenide; Heterojunctions; Indium gallium arsenide; Quantum well devices; Quantum wells; Shape; Temperature; δ-doping; InGaAs/GaAs; Real space transfer (RST); Real space transfer transistor (RSTT); negative differential resistance (NDR);
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4734592