DocumentCode :
2144634
Title :
Hot-swapping architecture with back-biased testing for mitigation of permanent faults in functional unit array
Author :
Rakossy, Zoltan Endre ; Hiromoto, Masayuki ; Tsutsui, Hiroshi ; Sato, Takashi ; Nakamura, Yukihiro ; Ochi, Hiroyuki
Author_Institution :
Department of Communication and Computer Engineering, Kyoto University, Yoshida-honmachi, Sakyo, 606-8501, Japan
fYear :
2013
fDate :
18-22 March 2013
Firstpage :
535
Lastpage :
540
Abstract :
Due to latest advances in semiconductor integration, systems are becoming more susceptible to faults leading to temporary or permanent failures. We propose a new architecture extension suitable for arrays of functional units (FUs), that will provide testing and replacement of faulty units, without interrupting normal system operation. The extension relies on data-path switching realized by the proposed hot-swapping algorithm and structures, by use of which functional units are tested and replaced by spares, at lower overheads than traditional modular redundancy. For a case study architecture, hot-swapping support could be added with only 29% area overhead. In this paper we focus on experimental evaluation of the hot-swapping system from a fabricated chip in 65nm CMOS process. Autonomous testing of the hot-swapping system is enhanced with back-bias circuitry to attain an early fault detection and restoration system. Experimental measurements prove that the proposed concept works well, predicting fault occurrence with a configurable prediction interval, while power measurements reveal that with only 20% power overhead the proposed system can attain reliability levels similar to triple modular redundancy. Additionally, measurements reveal that manufacturing randomness across the die can significantly influence identical sub-circuit reliability located in different parts in the die, although identical layout has been employed.
Keywords :
Arrays; Circuit faults; Random access memory; Reliability; Switches; Testing; Tunneling magnetoresistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013
Conference_Location :
Grenoble, France
ISSN :
1530-1591
Print_ISBN :
978-1-4673-5071-6
Type :
conf
DOI :
10.7873/DATE.2013.120
Filename :
6513566
Link To Document :
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