• DocumentCode
    2144712
  • Title

    Improving the process variation tolerability of flip-flops for UDSM circuit design

  • Author

    Hwang, Ju ; Kim, Wook ; Kim, Young Hwan

  • Author_Institution
    Pohang Univ. of Sci. & Technol. (POSTECH), Pohang, South Korea
  • fYear
    2010
  • fDate
    22-24 March 2010
  • Firstpage
    812
  • Lastpage
    817
  • Abstract
    The process variation of the ultra-deep submicron technology causes significant variation in the timing characteristics of flip-flops, and it can drop functional yield seriously, affecting system timing. This paper has two objectives. First, this paper investigates the sensitivities to process variation of four representative flip-flop architectures that are popularly used in digital circuit designs in respect of their functional robustness. Secondly, this paper proposes simple but effective methods to improve the process variation tolerability of those flip-flops. Experimental results on four benchmark flip-flops, which were optimized for minimum power-delay product, show that their variability of data-to-q delay reaches to 33.02% ~ 46.13% and functional yield reaches to 79.93% ~ 99.86%. Also, the experimental results clearly show that the proposed approaches improve the variability of data-to-q delay by 11.53% ~ 44.78% and functional yield by 0.11% ~ 24.41%.
  • Keywords
    flip-flops; logic design; timing; UDSM circuit design; digital circuit designs; flip-flops; process variation tolerability; system timing; ultra-deep submicron technology; Circuit synthesis; Combinational circuits; Delay; Digital circuits; Flip-flops; Performance analysis; Robustness; System performance; Timing; Very large scale integration; Flip-flop; Functional yield; Process variation; Tolerability; Variability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2010 11th International Symposium on
  • Conference_Location
    San Jose, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4244-6454-8
  • Type

    conf

  • DOI
    10.1109/ISQED.2010.5450488
  • Filename
    5450488