• DocumentCode
    2144877
  • Title

    An efficient FDTD approach of modeling power-delivery-planes with SMT decoupling capacitors

  • Author

    Tsai, Chia-Ling ; Wu, Tzong-Lin

  • Author_Institution
    Dept. of Electr. Eng., National Sun Yat-sen Univ., Kaohsiung, Taiwan
  • Volume
    2
  • fYear
    2003
  • fDate
    18-22 Aug. 2003
  • Firstpage
    581
  • Abstract
    Based on a two-dimensional (2D) finite-difference time-domain (FDTD method, an efficient numerical approach is proposed to model the power/ground planes characteristics with surface mount technology (SMT) capacitors above them. The parasitic inductance (or ESL) and resistance (or ESR) of the decoupling capacitors are both considered in series with the ideal capacitor in the modeling. By a proposed recursive updating formulation in the 2D-FDTD, the series RLC lump elements are implemented into one cell and are numerically embedded between power and ground planes. It will be shown that this approach not only keep good accuracy for predicting the power-bus behavior, but also significantly improve the computing efficiency compared with the 3D-FDTD method. The method is also applied to multi-layer structure by FDTD-SPICE method and illustrates its accuracy and efficiency.
  • Keywords
    capacitors; finite difference time-domain analysis; high-speed integrated circuits; printed circuit design; surface mount technology; FDTD approach; FDTD-SPICE method; RLC lump elements; SMT decoupling capacitors; finite-difference time-domain method; ground bounce; ground planes; multilayer PCB; multilayer structure; parasitic inductance; parasitic resistance; power delivery planes; power planes; power-bus behavior; surface mount technology; Artificial intelligence; Capacitors; Electromagnetic compatibility; Finite difference methods; Impedance; Laboratories; Paramagnetic resonance; Surface-mount technology; Time domain analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2003 IEEE International Symposium on
  • Print_ISBN
    0-7803-7835-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2003.1236667
  • Filename
    1236667