DocumentCode
2145031
Title
Integration technology parameters for physical design of vertical system-in-package
Author
Polityko, David Dmitry ; Guttowski, Stephan ; Reichl, Herbert
Author_Institution
Berlin Tech. Univ.
fYear
0
fDate
0-0 0
Abstract
A promising solution for achieving highest integration density has been seen in vertical integration of heterogeneous components as a system-in-package (SiP). An important success factor of 2.5/3D SiP is efficiency in physical design. The main content of this article is an introduction to the structuring of physical design, novel classification of 2.5D technologies, and the calculation of a parameter set, which provides key data for an objective comparison and selection of integration technologies for the design process of vertical integrated SiP
Keywords
integrated circuit design; system-in-package; 2.5D integration; chip stacking; heterogeneous components; high integration density; integration technology; physical design parameter; technology modeling; technology parameter; vertical SiP integration; vertical interconnects; vertical system-in-package; Bonding; Integrated circuit interconnections; Monolithic integrated circuits; Process design; Propagation delay; Routing; Stacking; Substrates; Wire; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
1-4244-0152-6
Type
conf
DOI
10.1109/ECTC.2006.1645839
Filename
1645839
Link To Document