DocumentCode
2145199
Title
Early-stage determination of current-density criticality in interconnects
Author
Jerke, Göran ; Lienig, Jens
Author_Institution
Automotive Electron. Div., Robert Bosch GmbH, Reutlingen, Germany
fYear
2010
fDate
22-24 March 2010
Firstpage
667
Lastpage
674
Abstract
Excessive current density within interconnects is a major concern for IC designers, which if not effectively mitigated leads to electromigration and electrical overstress. This is increasingly a problem in modern ICs due to smaller feature sizes and higher currents associated with lower supply voltages. Detailed analysis of all interconnect nets is both time-consuming and cannot be done until physical design is complete, when it is too late for easy fixes. To address these problems, we introduce (i) a powerful terminal current model and (ii) an efficient methodology to determine the worst-case bounds on segment currents of the interconnect. This early-stage calculation enables nets to be separated into critical and non-critical sets; only the set of critical nets, which is typically considerably smaller, requires subsequent special consideration during physical design and layout verification due to current density design limits. The presented algorithms are fast enough to run on every net, and work with known and unknown net topology, leading to several practical uses, such as (i) the pre-layout identification of nets that are potentially troublesome and may need sizing, (ii) as filter to avoid time-consuming detailed current-density analysis of net layouts, and (iii) to evaluate the effect of interconnect temperature and process changes on the number and distribution of current-density-critical nets.
Keywords
current density; electromigration; integrated circuit interconnections; IC designers; current density critical nets; current density criticality; current density design limits; electrical overstress; electromigration overstress; interconnect temperature; layout verification; net layouts; net topology; powerful terminal current model; Algorithm design and analysis; Analog integrated circuits; Automotive electronics; Cause effect analysis; Current density; Digital integrated circuits; Electromigration; Radio access networks; Topology; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2010 11th International Symposium on
Conference_Location
San Jose, CA
ISSN
1948-3287
Print_ISBN
978-1-4244-6454-8
Type
conf
DOI
10.1109/ISQED.2010.5450505
Filename
5450505
Link To Document