• DocumentCode
    2145255
  • Title

    Investigation of dielectric breakdown probability distribution for double-break vacuum circuit breaker

  • Author

    Shioiri, Tetsu ; Niwa, Yoshimitsu ; Kamikawaji, Toru ; Homma, Mitsutaka

  • Author_Institution
    Toshiba Corp., Tokyo, Japan
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    323
  • Lastpage
    326
  • Abstract
    Breakdown probability distribution before and after no-load switching was investigated for a vacuum interrupter made from copper-chromium alloy. Since the multi-break vacuum circuit breaker was considered as a method for realizing a high-voltage vacuum circuit breaker, a double-break vacuum circuit breaker was investigated for breakdown probability distribution. Breakdown probability distribution after no-load switching can be represented by a Weibull distribution in the same manner as before switching. The scatter of breakdown voltage increases when no-load switching is carried out. The shape parameter becomes constant, from 6.0 to 8.5 irrespective of the gap length. If the vacuum circuit breaker uses a double-break, breakdown probability at low voltage becomes lower than single-break probability. Although the double-break vacuum circuit breaker is inequality of potential distribution, its insulation reliability is better than that of the single-break vacuum interrupter even when the inequality of the vacuum interrupter´s sharing voltage is taken into account.
  • Keywords
    Weibull distribution; probability; switchgear testing; vacuum breakdown; vacuum circuit breakers; vacuum interrupters; CuCr; Weibull distribution; dielectric breakdown probability distribution; double-break vacuum circuit breaker; no-load switching; potential distribution inequality; vacuum interrupter; Circuit breakers; Copper alloys; Dielectric breakdown; Electric breakdown; Interrupters; Probability distribution; Scattering; Shape; Vacuum breakdown; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 2002. 20th International Symposium on
  • Print_ISBN
    0-7803-7394-4
  • Type

    conf

  • DOI
    10.1109/ISDEIV.2002.1027374
  • Filename
    1027374