Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60/spl deg/C

Author

Lau, John ; Lee, S. W Ricky ; Song, Fubin ; Lau, Dennis ; Shangguan, Dongkai

Author_Institution

Agilent Technol. Inc., Santa Clara, CA

fYear

0

fDate

0-0 0

Abstract

A new thermal-fatigue life prediction equation for a plastic ball grid array (PBGA) package with 95.5wt%Sn4.0wt%Ag0.5wt%Cu lead-free solder balls is proposed in this investigation. The test vehicle consists of the PBGA package, a lead-free PCB, and a lead-free solder paste (95.5wt%Sn3.9wt%Ag0.6wt%Cu). The coefficients of the fatigue equation presented herein are determined by best fit of the test vehicle´s isothermal fatigue data tested at 60degC. Failure modes and locations of the failed samples are discussed

Keywords

ball grid arrays; copper alloys; failure analysis; fatigue testing; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; life testing; plastic packaging; silver alloys; solders; tin alloys; PBGA; SnAgCu; isothermal fatigue tests; lead-free PCB; lead-free solder joints; lead-free solder paste; life prediction equation; plastic ball grid array; Electronics packaging; Environmentally friendly manufacturing techniques; Equations; Fatigue; Isothermal processes; Lead; Plastics; Soldering; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645851

Filename

1645851