• DocumentCode
    2145379
  • Title

    CDM protection of high voltage LDMOS for automotive applications

  • Author

    Gill, Chai ; Goyal, Abhijat

  • Author_Institution
    Technol. Solution Organ., Freescale Semicond. Inc., Tempe, AZ, USA
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    628
  • Lastpage
    631
  • Abstract
    In recent years, CDM compliance has been widely accepted as a critical part of product qualification to ensure product robustness. Hence technologies developed to support automotive market has increasingly required full AEC-Q100 ESD compliance to include a minimum of 500 V CDM robustness in addition to HBM and MM specifications. The high voltage devices developed to support 45 V to 80 V pins are typical requirements for automotive designs to support inductive loading from solenoid current which can generate dual polarity peak transients. The ESD protections designed for these pins need to be very compact high current device capable of clamping +65 V in forward mode coupled with -5 V in reverse mode. These ESD protections must also respond to transients of rise time (tr) ranging from 10 ns to 100 ps to protect against HBM to CDM stress. This paper will present CDM design strategy to protect high voltage laterally diffused MOS (LDMOS) devices, requiring both primary and secondary ESD protection circuitry for 750 V CDM compliance.
  • Keywords
    MOS integrated circuits; electrostatic discharge; power integrated circuits; CDM; ESD protection circuitry; automotive applications; charged-device model; clamping; high current device; high voltage LDMOS; high voltage devices; laterally diffused MOS devices; rise time; voltage 750 V; Automotive applications; Automotive engineering; Clamps; Electrostatic discharge; Pins; Protection; Qualifications; Robustness; Solenoids; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734623
  • Filename
    4734623