DocumentCode
2145442
Title
Recovery characteristics of NBTI of pMOSFETs with oxynitride dielectrics under drain bias
Author
Yang, Jiaqi ; Pan, Junyan ; Huang, Lihua ; Liu, Xiaoyan ; Han, Ruqi ; Kang, Jinfeng ; Zhang, L.F. ; Zhu, Z.W. ; Liao, C.C. ; Wu, H.M.
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
636
Lastpage
639
Abstract
In this paper, the recovery characteristics of negative bias temperature instability (NBTI) of pMOSFETs under drain bias were studied. It is observed that, the drain bias not only worsens the NBTI degradation in high |Vds| region but also suppresses the recovery ratio of NBTI. The time evolutions of recovery show that the drain bias dependent NBTI recovery is mainly related to the fast recovery effect in initial 1s. While in long time scale, the recovery obeys power law dependence on time. A physical model based on donor-type interface traps neutralization at the beginning of recovery is proposed to explain the suppressed recovery ratio under drain bias.
Keywords
MOSFET; radiation hardening (electronics); NBTI; donor-type interface; drain bias; oxynitride dielectrics; pMOSFET; recovery characteristics; Circuits; Degradation; Dielectric measurements; MOSFETs; Microelectronics; Negative bias temperature instability; Niobium compounds; Phase measurement; Stress measurement; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734625
Filename
4734625
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