DocumentCode
2145555
Title
Processing and performance of broadband integrated resistor structures on non-planar topologies in hermetic silicon enclosure with vertical micro vias
Author
Greisen, Christoffer Graae ; Hauffe, Ralf ; Shiv, Lior ; Weichel, Steen ; Korth, Hilmar ; Kilian, Arnd ; Heschel, Matthias ; Kuhmann, Jochen
Author_Institution
Hymite A/S, Lyngby
fYear
0
fDate
0-0 0
Abstract
We present the integration of thin film nickel-chromium (NiCr) resistors into a hermetic, 3D structured silicon packaging platform for wafer level sealing and demonstrate their performance as broadband passive components. Resistors on the cavity side walls can be designed by modeling the material deposition as a unidirectional flux
Keywords
chromium alloys; electrodeposition; network topology; nickel alloys; passive networks; thin film resistors; NiCr; broadband integrated resistor; broadband passive components; silicon packaging; thin film resistors; vertical micro vias; wafer level sealing; Conducting materials; Etching; Gold; Metallization; Packaging; Resistors; Semiconductor thin films; Silicon; Substrates; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
1-4244-0152-6
Type
conf
DOI
10.1109/ECTC.2006.1645860
Filename
1645860
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