• DocumentCode
    2146019
  • Title

    Effect of mechanical polish of electrode on several breakdown characteristics of vacuum gap

  • Author

    Sato, Shinji ; Koyama, Kenichi

  • Author_Institution
    Mitsubishi Electr. Corp., Hyogo, Japan
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    427
  • Lastpage
    430
  • Abstract
    For the purpose of controlling conductor surface roughness, relationships between breakdown voltage of vacuum gaps and electrode surface roughness were discussed The roughness of mechanically polished Cu and CuCr electrodes were measured by a roughness meter. Experimental formula between breakdown voltage and surface roughness were obtained for plate-to-plate gaps of both Cu and CuCr electrodes. It was shown that the discharge conditioning effect increased with reducing the value of surface roughness. The breakdown voltage depended on not only cathode surface but also anode. Moreover, for nonuniform field gaps after treating the discharge conditioning, it was found that improvement in surface roughness was not effective on increasing breakdown voltage.
  • Keywords
    anodes; cathodes; chromium alloys; conductors (electric); copper; copper alloys; polishing; surface topography measurement; vacuum breakdown; Cu and CuCr electrodes polishing effect on vacuum gap breakdown characteristics; breakdown characteristics; breakdown voltage; conductor surface roughness control; discharge conditioning effect; electrode; mechanical polish effect; mechanically polished Cu. electrodes; mechanically polished CuCr electrodes; plate-to-plate gaps; roughness meter; surface roughness reduction; vacuum gap; Cathodes; Conductors; Electrodes; Mechanical variables measurement; Rough surfaces; Surface discharges; Surface roughness; Surface treatment; Vacuum breakdown; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 2002. 20th International Symposium on
  • Print_ISBN
    0-7803-7394-4
  • Type

    conf

  • DOI
    10.1109/ISDEIV.2002.1027400
  • Filename
    1027400