Title :
High epitaxial growth rate of 4H-SiC using TCS as silicon precursor
Author :
Ji, Gang ; Sun, Guosheng ; Ning, Jin ; Liu, Xingfang ; Zhao, Yongmei ; Wang, Lei ; Zhao, Wanshun ; Zeng, Yiping
Author_Institution :
Key Lab. of Semicond. Mater. Sci., Chinese Acad. of Sci., Beijing, China
Abstract :
High homoepitaxial growth of 4H-SiC has been performed in a home-made horizontal hot wall CVD reactor on n-type 4H-SiC 8° off-oriented substrates in the size of 10 mm à 10 mm, using trichlorosilane (TCS) as silicon precursor source together with ethylene as carbon precursor source. Cross-section Scanning Electron Microscopy (SEM), Raman scattering spectroscopy and Atomic Force Microscopy (AFM) were used to determine the growth rate, structural property and surface morphology, respectively. The growth rate reached to 23 ¿m/h and the optimal epilayer was obtained at 1600°C with TCS flow rate of 12 sccm in C/Si of 0.42, which has a good surface morphology with a low Rms of 0.64 nm in 10 ¿mÃ10 ¿m area.
Keywords :
Raman spectra; atomic force microscopy; chemical vapour deposition; scanning electron microscopy; semiconductor epitaxial layers; semiconductor growth; semiconductor materials; silicon compounds; surface morphology; vapour phase epitaxial growth; AFM; Raman scattering spectroscopy; SEM; SiC; TCS; atomic force microscopy; carbon precursor source; cross-section scanning electron microscopy; epitaxial growth rate; ethylene; growth rate; homoepitaxial growth; horizontal hot wall CVD reactor; n-type 4H-SiC off-oriented substrates; silicon precursor; silicon precursor source; structural property; surface morphology; temperature 1600 degC; trichlorosilane; Atomic force microscopy; Epitaxial growth; Epitaxial layers; Inductors; Phonons; Raman scattering; Scanning electron microscopy; Silicon; Spectroscopy; Surface morphology;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4734649