DocumentCode
2146032
Title
High epitaxial growth rate of 4H-SiC using TCS as silicon precursor
Author
Ji, Gang ; Sun, Guosheng ; Ning, Jin ; Liu, Xingfang ; Zhao, Yongmei ; Wang, Lei ; Zhao, Wanshun ; Zeng, Yiping
Author_Institution
Key Lab. of Semicond. Mater. Sci., Chinese Acad. of Sci., Beijing, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
696
Lastpage
698
Abstract
High homoepitaxial growth of 4H-SiC has been performed in a home-made horizontal hot wall CVD reactor on n-type 4H-SiC 8° off-oriented substrates in the size of 10 mm à 10 mm, using trichlorosilane (TCS) as silicon precursor source together with ethylene as carbon precursor source. Cross-section Scanning Electron Microscopy (SEM), Raman scattering spectroscopy and Atomic Force Microscopy (AFM) were used to determine the growth rate, structural property and surface morphology, respectively. The growth rate reached to 23 ¿m/h and the optimal epilayer was obtained at 1600°C with TCS flow rate of 12 sccm in C/Si of 0.42, which has a good surface morphology with a low Rms of 0.64 nm in 10 ¿mÃ10 ¿m area.
Keywords
Raman spectra; atomic force microscopy; chemical vapour deposition; scanning electron microscopy; semiconductor epitaxial layers; semiconductor growth; semiconductor materials; silicon compounds; surface morphology; vapour phase epitaxial growth; AFM; Raman scattering spectroscopy; SEM; SiC; TCS; atomic force microscopy; carbon precursor source; cross-section scanning electron microscopy; epitaxial growth rate; ethylene; growth rate; homoepitaxial growth; horizontal hot wall CVD reactor; n-type 4H-SiC off-oriented substrates; silicon precursor; silicon precursor source; structural property; surface morphology; temperature 1600 degC; trichlorosilane; Atomic force microscopy; Epitaxial growth; Epitaxial layers; Inductors; Phonons; Raman scattering; Scanning electron microscopy; Silicon; Spectroscopy; Surface morphology;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734649
Filename
4734649
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