Title :
Design and implementations of RF systems and sub-systems in LCP-type multilayer technology
Author :
Dalmia, S. ; Govind, V. ; Dekosky, J. ; Sundaram, Venky ; White, G. ; Swaminathan, Madhavan
Author_Institution :
Jacket Micro Devices, Inc., Atlanta, GA
Abstract :
Miniaturization and data throughput are key driving factors in the growth and deployment of wireless LAN (WLAN) networks. This paper presents a novel LCP-based organic packaging technology for implementation of RF systems and sub-systems. Examples shown include low-profile baluns, bandpass filters and front-end modules (FEM) for 802.11a/b/g and 802.11n applications
Keywords :
liquid crystal polymers; multilayers; plastic packaging; LCP-based organic packaging technology; LCP-type multilayer technology; RF sub-systems; RF systems; Band pass filters; Capacitors; Impedance matching; Inductors; Laminates; Lattices; Nonhomogeneous media; Radio frequency; Substrates; Wireless LAN;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645880
