Title :
Piezoresistive linearity analysis of polysilicon nanofilms deposited at different temperatures based on interstitial-vacancy model
Author :
Shi, Changzhi ; Liu, Xiaowei ; Chuai, Rongyan
Author_Institution :
Dept. of Microelectron., Harbin Inst. of Technol., Harbin, China
Abstract :
From our previous investigations, polysilicon nano-films (PSNFs) shows large gauge factor (>30) and lower temperature coefficients of resistance and gauge factor at high doping concentration, comparing with the common polysilicon films. The films are suitable for high temperature piezoresistive sensors. In this paper, the PSNFs doped highly (2Ã1020 cm-3) were prepared by LPCVD at different deposition temperatures, and the following measurements of resistivity, gauge factor and linearity of the films were performed. Based on as-established interstitial-vacancy model of grain boundaries, the structure, piezoresistive properties and linearity of PSNFs were analyzed. The influence of residual hydrogen atoms in films was also taken into consideration. The model is proved to have good agreement with experiment results. Finally, it can be obtained that using the optimized deposition temperature (620°C) and high temperature annealing, the PSNFs containing fewer amorphous phases and residual hydrogen atoms had better piezoresistive linearity.
Keywords :
electrical resistivity; elemental semiconductors; grain boundaries; nanostructured materials; piezoresistance; semiconductor doping; semiconductor thin films; silicon; Si; doping concentration; gauge factor; grain boundaries; high temperature annealing; high temperature piezoresistive sensors; interstitial-vacancy model; piezoresistive linearity analysis; piezoresistive properties; polysilicon nanofilms; residual hydrogen atoms; resistivity; Atomic layer deposition; Conductivity; Doping; Grain boundaries; Hydrogen; Linearity; Performance evaluation; Piezoresistance; Semiconductor process modeling; Temperature sensors;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
DOI :
10.1109/ICSICT.2008.4734653