Title :
SPICE model libraries for via transitions
Author :
Luan, Shaofeng ; Selli, Giuseppe ; Fan, Jun ; Lai, Mauro ; Knighten, James L. ; Smith, Norm W. ; Alexander, Ray ; Antonini, Giulio ; Ciccomancini, Antonio ; Orlandi, Antonio ; Drewniak, James L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA
Abstract :
A procedure of building SPICE models for signal via transitions between printed circuit board layers is presented in this paper. The method of extracting parameters of SPICE models from full-wave simulation tool is demonstrated. Then the validity of SPICE models is studied by comparing the solution from SPICE model with that from the full-wave simulation.
Keywords :
SPICE; integrated circuit interconnections; printed circuit layout; CEMPIE; PEEC; SPICE model library; circuit extraction based on mixed potential integral equation; full-wave simulation tool; multilayer PCB; parameter extraction; partial element equivalent circuit; printed circuit board layers; signal via transitions; Circuit testing; Electromagnetic compatibility; Geometry; Integral equations; Libraries; Microstrip; Printed circuits; SPICE; Shape measurement; Solid modeling;
Conference_Titel :
Electromagnetic Compatibility, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7835-0
DOI :
10.1109/ISEMC.2003.1236721
