Title :
Break down voltage of electrode arrangements in vacuum in consideration of surface area
Author :
Schumann, U. ; Kurrat, Michael
Author_Institution :
Inst. for High Voltage & Electr. Powers Apparatus, Technische Univ. Braunschweig, Germany
Abstract :
Today different models exist to explain the mechanism of high voltage breakdown of electrode arrangements in vacuum. Experimental investigations support two empirical approaches: particle and field emission induced breakdown. It should be considered that the experimental results are influenced by electrode material, surface finish, surface area, conditioning of the surface and the geometry of the electrode arrangement. In this work, an empirical relation between the breakdown voltage of the electrode arrangement and the surface area aims to be found. To this purpose, a borda profile is stressed with lightning impulse voltage. The borda profile has the advantage of homogenous field distribution over the whole surface area of the electrode arrangement. Other parameters such as the surface finish or the electrode material are kept constant to receive the same conditions during measurement. Additional measurements with coplanar profiles are also presented. The first results and deliberations for an empirical approach are shown.
Keywords :
electrodes; insulation testing; surface topography; vacuum breakdown; vacuum insulation; borda profile; coplanar profiles; dielectric strength; electrode arrangements breakdown voltage; electrode geometry; electrode material; field emission-induced breakdown; homogenous field distribution; lightning impulse voltage; particle-induced breakdown; surface area considerations; surface conditioning; surface finish; vacuum insulation breakdown; Dielectric breakdown; Dielectric measurements; Electrodes; Geometry; Lightning; Rough surfaces; Surface finishing; Surface roughness; Testing; Voltage;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 2002. 20th International Symposium on
Print_ISBN :
0-7803-7394-4
DOI :
10.1109/ISDEIV.2002.1027408