DocumentCode :
2146228
Title :
Impurity effect on internal gettering in Czochralski silicon
Author :
Chen, Jiahe ; Yang, Deren ; Ma, Xiangyang ; Que, Duanlin
Author_Institution :
Dept. of Mater. Sci. & Eng., Zhejiang Univ., Hangzhou, China
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
777
Lastpage :
779
Abstract :
With the rapid reduction in feature size of ultra large scaled integrate (ULSI) circuits, the microdefects in Czochralski silicon (Cz-Si) such as oxygen precipitates play increasingly important roles in the reliability of devices. In recent years, the novel properties of impurity (nitrogen, germanium and carbon) doped Cz-Si materials have attracted increasingly considerable attentions. In this presentation, the recent processes of our group¿s investigation on the internal gettering (IG) structures in aforementioned Cz-Si wafers have been reviewed. It has been considered that the density of gettering sites for metallic contamination are higher than that of the normal wafers and the denuded zone (DZ) with the desirable width for ULSI device fabrication can be both generated. The comparison of the generation of IG structures among the common silicon wafer and the nitrogen, germanium and high carbon content silicon wafers has been presented and the impurity engineering for the Cz-Si materials has also been emphasized.
Keywords :
ULSI; contamination; crystal growth from melt; getters; integrated circuit manufacture; integrated circuit technology; semiconductor technology; Czochralski silicon internal gettering; Czochralski silicon microdefects; Si; impurity effect; impurity engineering; metallic contamination; ultra large scaled integrated circuits; Contamination; Fabrication; Germanium; Gettering; Impurities; Integrated circuit reliability; Nitrogen; Organic materials; Silicon; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734659
Filename :
4734659
Link To Document :
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