• DocumentCode
    2146228
  • Title

    Impurity effect on internal gettering in Czochralski silicon

  • Author

    Chen, Jiahe ; Yang, Deren ; Ma, Xiangyang ; Que, Duanlin

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Zhejiang Univ., Hangzhou, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    777
  • Lastpage
    779
  • Abstract
    With the rapid reduction in feature size of ultra large scaled integrate (ULSI) circuits, the microdefects in Czochralski silicon (Cz-Si) such as oxygen precipitates play increasingly important roles in the reliability of devices. In recent years, the novel properties of impurity (nitrogen, germanium and carbon) doped Cz-Si materials have attracted increasingly considerable attentions. In this presentation, the recent processes of our group¿s investigation on the internal gettering (IG) structures in aforementioned Cz-Si wafers have been reviewed. It has been considered that the density of gettering sites for metallic contamination are higher than that of the normal wafers and the denuded zone (DZ) with the desirable width for ULSI device fabrication can be both generated. The comparison of the generation of IG structures among the common silicon wafer and the nitrogen, germanium and high carbon content silicon wafers has been presented and the impurity engineering for the Cz-Si materials has also been emphasized.
  • Keywords
    ULSI; contamination; crystal growth from melt; getters; integrated circuit manufacture; integrated circuit technology; semiconductor technology; Czochralski silicon internal gettering; Czochralski silicon microdefects; Si; impurity effect; impurity engineering; metallic contamination; ultra large scaled integrated circuits; Contamination; Fabrication; Germanium; Gettering; Impurities; Integrated circuit reliability; Nitrogen; Organic materials; Silicon; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734659
  • Filename
    4734659