• DocumentCode
    2146265
  • Title

    Improvement of dielectric properties of ZrO2 films prepared by limited reaction sputtering

  • Author

    Zhou, Ying ; Kojima, Nobuo ; Sasaki, Kimihiro ; Kumeda, Minoru

  • Author_Institution
    Grad. Sch. of Natural Sci. & Technol., Kanazawa Univ., Kanazawa, Japan
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    784
  • Lastpage
    787
  • Abstract
    We investigated the growth of crystalline ZrO2 film prepared on p-Si(100) by limited reaction sputtering system under different growth temperatures from 400 to 700°C. The structural characteristics of the samples were studied by XRD, RHEED and AFM, which provided a solid identification of the phase transformation from monoclinic phase to tetragonal phase. The dielectric properties were studied by C-V and I-V measurements on Au/ZrO2/p-Si(100) MIS structures, suggesting that the tetragonal ZrO2 thin film shows excellent dielectric performances including a high permittivity up to 32 as well as a negligible flatband voltage shift in C-V curves.
  • Keywords
    MIS structures; X-ray diffraction; atomic force microscopy; crystal structure; dielectric thin films; electrical conductivity; elemental semiconductors; insulating thin films; permittivity; reflection high energy electron diffraction; silicon; solid-state phase transformations; sputter deposition; zirconium compounds; AFM; Au-ZrO2-Si; C-V measurements; I-V measurements; MIS structures; RHEED; Si; XRD; crystalline film growth; dielectric films; growth temperatures; limited reaction sputtering; monoclinic-tetragonal phase transformation; p-Si (100); permittivity; temperature 400 degC to 700 degC; Capacitance-voltage characteristics; Crystallization; Dielectric measurements; Dielectric thin films; Gold; Permittivity measurement; Solids; Sputtering; Temperature; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734661
  • Filename
    4734661