Title :
Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions
Author :
Han, F.Y. ; Wu, J.M. ; Horng, T.S. ; Lin, J. ; Tu, C.C.
Author_Institution :
Dept. of Electr. Eng., National Sun Yat-Sen Univ., Kaohsiung
Abstract :
This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90deg phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results
Keywords :
MMIC; chip-on-board packaging; code division multiple access; integrated circuit interconnections; modulators; printed circuits; 3D EM simulation tool; IQ modulator MMIC; MMIC design; PCB effects; PCB interconnects; W-CDMA modulator module; chip-package-board interactions; direct-conversion IQ modulator module; equivalent-circuit elements; error vector magnitude; package interconnects; phase shift; sideband suppression; Capacitance; Circuit testing; Differential amplifiers; Inductance; Low pass filters; MMICs; Multiaccess communication; Packaging; Phase modulation; Phase shifters;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645891
