Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions

Author

Han, F.Y. ; Wu, J.M. ; Horng, T.S. ; Lin, J. ; Tu, C.C.

Author_Institution

Dept. of Electr. Eng., National Sun Yat-Sen Univ., Kaohsiung

fYear

0

fDate

0-0 0

Abstract

This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90deg phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results

Keywords

MMIC; chip-on-board packaging; code division multiple access; integrated circuit interconnections; modulators; printed circuits; 3D EM simulation tool; IQ modulator MMIC; MMIC design; PCB effects; PCB interconnects; W-CDMA modulator module; chip-package-board interactions; direct-conversion IQ modulator module; equivalent-circuit elements; error vector magnitude; package interconnects; phase shift; sideband suppression; Capacitance; Circuit testing; Differential amplifiers; Inductance; Low pass filters; MMICs; Multiaccess communication; Packaging; Phase modulation; Phase shifters;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645891

Filename

1645891