DocumentCode
2146341
Title
Performance improvement of flash memory with a novel quasi-SOI structure
Author
Tang, Poren ; Wu, Dake ; Huang, Ru
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
846
Lastpage
849
Abstract
A novel quasi-silicon-on-insulator (quasi-SOI) flash memory cell is proposed for the first time. By utilizing quasi-SOI structure, program/erase (P/E) performance improvement is achieved due to the enhancement of electric field in the injection region, compared with conventional cell structure. Moreover, the off-state current at large drain bias is greatly reduced by 2 orders of magnitude with the help of the L-shaped dielectric layer, indicating better program-failure immunity and lower unexpected power consumption. With punch-through effect alleviated, the novel flash cells have better scalability. Through the results and analysis, the proposed flash cell can be a potential candidate for NOR-type applications.
Keywords
dielectric materials; electric fields; flash memories; silicon-on-insulator; L-shaped dielectric layer; electric field; flash memory cell; injection region; program-failure immunity; program/erase performance improvement; quasiSOI structure; quasisilicon-on-insulator; Dielectric substrates; Electrons; Energy consumption; Flash memory; Flash memory cells; Hydrodynamics; Nonvolatile memory; Poisson equations; Scalability; Semiconductor process modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734665
Filename
4734665
Link To Document