• DocumentCode
    2146341
  • Title

    Performance improvement of flash memory with a novel quasi-SOI structure

  • Author

    Tang, Poren ; Wu, Dake ; Huang, Ru

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    846
  • Lastpage
    849
  • Abstract
    A novel quasi-silicon-on-insulator (quasi-SOI) flash memory cell is proposed for the first time. By utilizing quasi-SOI structure, program/erase (P/E) performance improvement is achieved due to the enhancement of electric field in the injection region, compared with conventional cell structure. Moreover, the off-state current at large drain bias is greatly reduced by 2 orders of magnitude with the help of the L-shaped dielectric layer, indicating better program-failure immunity and lower unexpected power consumption. With punch-through effect alleviated, the novel flash cells have better scalability. Through the results and analysis, the proposed flash cell can be a potential candidate for NOR-type applications.
  • Keywords
    dielectric materials; electric fields; flash memories; silicon-on-insulator; L-shaped dielectric layer; electric field; flash memory cell; injection region; program-failure immunity; program/erase performance improvement; quasiSOI structure; quasisilicon-on-insulator; Dielectric substrates; Electrons; Energy consumption; Flash memory; Flash memory cells; Hydrodynamics; Nonvolatile memory; Poisson equations; Scalability; Semiconductor process modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734665
  • Filename
    4734665