Title :
Low cost 4-channel CWDM splitter using SiOB packaging
Author :
Li, J. ; Goh, Joelle K H ; Lee, Bryan S P ; Zhang, Q.X. ; Ramana, Pamidighantam V. ; Pinjala, Damaruganath
Author_Institution :
Inst. of Microelectron.
Abstract :
In this paper, the development of a low cost 4-channel coarse wavelength division multiplexer (CWDM) splitter is reported. The CWDM splitter consists of 3 thin film filters (TFF), 4 high reflection micro-mirrors (MM) and 4 ball lenses (BL) which are all assembled on a silicon optical bench (SiOB). The configuration of the CWDM splitter is modeled in three dimensional space by using commercial optical design software ASAP. The MMs are obtained by metal deposition on silicon wafer and dicing technology. The SiOB is fabricated by applying microelectromechanical system (MEMS) technology including wet anisotropic etch and dry deep reactive ion etching (DRIE) anisotropic etch processes. Finally the individual optical components are assembled and experimentally tested by employing optical spectrum analyzer (OSA) as multi-channel receiver for CWDM applications. The prototype showed a cumulative loss of 5.8 dB for the first channel due to the alignment tolerance. The bandwidth of individual channel is about 21.8 nm at 30 dB
Keywords :
electronics packaging; lenses; micromechanical devices; micromirrors; multiplexing equipment; optical beam splitters; silicon; spectral analysers; sputter etching; thin film devices; wavelength division multiplexing; 3D space; 5.8 dB; ASAP; CWDM splitter; DRIE; MEMS technology; Si; SiOB packaging; anisotropic etch processes; ball lenses; coarse wavelength division multiplexer splitter; dicing technology; dry deep reactive ion etching; high reflection micromirrors; metal deposition; microelectromechanical system; multichannel receiver; optical components; optical design software; optical spectrum analyzer; silicon optical bench; silicon wafer; thin film filters; wet anisotropic etch; Assembly; Costs; Dry etching; Optical films; Optical filters; Optical receivers; Packaging; Silicon; Space technology; Wet etching;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645894
